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3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.
Scotch-Weld™, 7000028575, Adhesive, Epoxy, Series: 270, Drum Container, 5 gal Container, Composition: Paste, 70 min Work Life, 48 hr Curing, 72 deg F
| Base Type | : | Epoxy |
| Color | : | Clear |
| Composition | : | Paste |
| Container Size | : | 5 gal |
| Container Type | : | Drum |
| Curing Time | : | 48 hr |
| For Use On | : | Metal |
| Functional Cure | : | 3 hr |
| Mixing Ratio | : | 1:1 |
| Series | : | 270 |
| Temperature Range | : | 72 deg F |
| Type | : | Epoxy |
| VOC Content | : | |
| Work Life | : | 70 min |
- Rigid potting compound is non-corrosive to copper
- Minimal exotherm and very low shrinkage
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https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/3M_7000001189_User_Manual.pdf
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https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/Scotch_Weld_7000028575_Specification_Sheet.pdf
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https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/Scotch-Weld_7000046400_Technical_Bulletin.pdf