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MMMR 41718

Scotch� 7000006086 130C Linerless Premium Grade Splicing Tape, 30 ft L 1-1/2 in W, 30 mil THK, Ethylene Rubber Backing, Black

  • Manufacturer: 3M
  • Brand Name: Scotch®
  • Part Number: MMMR 41718
  • MPN: 7000006086
  • UPC: 054007417187
  • Min. Order Qty: 1
  • Qty. Interval: 1
  • loading Available at Reynolds & Son, Inc - So Barre

Scotch� linerless rubber splicing tape 130C is a highly conformable, linerless, ethylene rubber (EPR), high voltage insulating tape, formulated to provide excellent thermal dissipation of splice heat. The tape is designed for use in splicing and terminating wires and cables. Rated upto 90 deg C continuous operating temperatures and short term 130 deg C overload service. The tape has excellent physical and electrical properties, which provide immediate moisture seals and void-free build-ups. This product can be used for low and high voltage (through 69 kV) applications.

Scotch�, 7000006086, Splicing Tape, Linerless Premium Grade, Series: 130C, 30 ft Length, 1-1/2 in Width, 30 mil Thickness, Black, Ethylene Rubber Backing, 250 psi Tensile Strength, 194 deg F Maximum Operating, Specifications Met: ASTM D4325, ASTM 4388, ASTM C518

Adhesive Material      :      Rubber Resin
Backing Material      :      Ethylene Rubber
Color      :      Black
Length      :      30 ft
Material Type      :      Rubber
Maximum Operating Temperature      :      194 deg F
Series      :      130C
Specifications Met      :      ASTM D4325, ASTM 4388, ASTM C518
Tensile Strength      :      250 psi
Thickness      :      30 mil
Type      :      Linerless Premium Grade
Width      :      1-1/2 in
  • Tensile strength rating of 17 in-lb meets professional electrical standards
  • Meet ASTM D4388, D4325, and C518. RoHS 2011/65/EU Compliant.
  • Highly conformable, rubber resin adhesive and the self-fusing, ethylene propylene, rubber backing provides UV resistance
  • Provides an excellent thermal dissipation of splice heat
  • Excellent electrical and mechanical properties offer a moisture seal and void-free buildups